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TDA7801PD 数据表(PDF) 3 Page - STMicroelectronics |
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TDA7801PD 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 8 page ![]() TDA7801 Package information 3/8 2 Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. PowerSO36 (slug-up) mechanical data and package dimensions OUTLINE AND MECHANICAL DATA M. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 3.25 3.43 0.128 0.135 A2 3.1 3.2 0.122 0.126 A4 0.8 1 0.031 0.039 A5 0.2 0.008 a1 0.030 -0.040 0.0011 -0.0015 b 0.22 0.38 0.008 0.015 c 0.23 0.32 0.009 0.012 D 15.8 16 0.622 0.630 D1 9.4 9.8 0.37 0.38 D2 1 0.039 E 13.9 14.5 0.547 0.57 E1 10.9 11.1 0.429 0.437 E2 2.9 0.114 E3 5.8 6.2 0.228 0.244 E4 2.9 3.2 0.114 1.259 e0.65 0.026 e3 11.05 0.435 G 0 0.075 0 0.003 H 15.5 15.9 0.61 0.625 h 1.1 0.043 L 0.8 1.1 0.031 0.043 N 10˚ 10˚ s8 ˚8˚ (1) “D and E1” do not include mold flash or protusions. Mold flash or protusions shall not exceed 0.15mm (0.006”) (2) No intrusion allowed inwards the leads. DI PowerSO36 (SLUG UP) 7183931 D |
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