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STP24NF10 数据表(PDF) 2 Page - STMicroelectronics |
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STP24NF10 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 6 page ![]() THERMAL DATA Rthj-case Rthj-amb T l Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Maximum Lead Temperature F or Soldering Purpose 1.87 62.5 300 oC/W oC/W oC ELECTRICAL CHARACTERISTICS (Tcase =25 oC unless otherwise specified) OFF Symbo l Parameter Test Con ditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID =250 µAVGS = 0 100 V IDSS Zero Gat e Voltage Drain Current (VGS =0) VDS =Max Rating VDS =Max Rating Tc =125 oC 1 10 µA µA IGSS Gat e-body Leakage Current (VDS =0) VGS = ± 20 V ± 100 nA ON ( ∗) Symbo l Parameter Test Con ditions Min. Typ. Max. Unit VGS(th) Gat e Threshold Voltage VDS =VGS ID = 250 µA 234 V RDS(on) Static Drain-source On Resistance VGS =10 V ID = 12 A 0.07 0.077 Ω ID(o n) On State Drain Current VDS >ID(o n) xRDS(on )max VGS =10 V 24 A DYNAMIC Symbo l Parameter Test Con ditions Min. Typ. Max. Unit gfs ( ∗)Forward Transconductance VDS >ID(o n) xRDS(on )max ID =12 A 20 S Ciss Cos s Crss Input Capacitance Out put Capacitance Reverse Transfer Capacitance VDS = 25V f = 1MHz VGS = 0 870 125 52 pF pF pF STP24NF10 2/6 |
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