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TS2007FC 数据表(PDF) 26 Page - STMicroelectronics |
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TS2007FC 数据表(HTML) 26 Page - STMicroelectronics |
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26 / 28 page ![]() Package information TS2007FC 26/28 Figure 49. 9-bump flip-chip package mechanical data ● Die size: 1.57 mm x 1.57 mm ±30 µm ● Die height (including bumps): 600 µm ● Bump diameter: 315 µm ±50 µm ● Bump diameter before reflow: 300 µm ±10 µm ● Bump height: 250 µm ±40 µm ● Die height: 350 µm ±20 µm ● Pitch: 500 µm ±50 µm ● Back coating layer height*: 40 µm ±10 µm ● Coplanarity: 50 µm max * Optional 600µm 40µm 600µm 40µm 1.57 mm 1.57 mm 0.5mm 0.5mm ∅ 0.25mm 1.57 mm 1.57 mm 0.5mm 0.5mm ∅ 0.25mm |
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