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TS4601 数据表(PDF) 26 Page - STMicroelectronics |
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TS4601 数据表(HTML) 26 Page - STMicroelectronics |
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26 / 28 page  Package information TS4601 26/28 Figure 55. Marking (top view) Figure 56. Flip-chip - 16 bumps Figure 57. Device orientation in the tape pocket ■ Logo: ST ■ Symbol for lead-free: E ■ Part number: 01 ■ X digit: Assembly code ■ Date code: YWW ■ The dot marks pin A1 01X YWW E 01X YWW E ■ Die size: 2.1mm x 2.1mm ± 30µm ■ Die height (including bumps): 600µm ■ Bumps diameter: 315µm ±50µm ■ Bump diameter before reflew: 300µm ±10µm ■ Bump height: 250µm ±40µm ■ Die height: 350µm ±20µm ■ Pitch: 500µm ±50µm ■ Coplanarity: 60µm max 500µm 500µm 2100µm 2100µm 600µm 500µm 500µm 2100µm 2100µm 600µm User direction of feed 8 Die size X + 70µm 4 All dimensions are in mm A 1 A 1 User direction of feed 8 Die size X + 70µm 4 All dimensions are in mm A 1 A 1 |
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