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TS4972 数据表(PDF) 29 Page - STMicroelectronics |
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TS4972 数据表(HTML) 29 Page - STMicroelectronics |
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29 / 30 page  Package Mechanical Data TS4972 29/30 5 Package Mechanical Data 5.1 Flip-Chip - 8 BUMPS ■ Die size : (2.26mm ±10%) x (1.6mm ±10%) ■ Die height (including bumps) : 650 µm ± 50 ■ Bumps diameter : 315 µm ±15µm ■ Silicon thickness : 400 µm ±25µm ■ Pitch: 500 µm ±10µm 2.26 2.26 1.6 0.5 0.5 400µm 250µm 650µm 400µm 250µm 650µm Figure 90: Pin Out (top view) ■ Balls are underneath Figure 91: Marking (top view) A72 YWW E A72 YWW E |
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