TDA7439

Package information

21/23

8

Package information

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

SDIP30 (0.400")

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

5.08

0.20

A1

0.51

0.020

A2

3.05

3.81

4.57

0.12

0.15

0.18

B

0.36

0.46

0.56

0.014

0.018

0.022

B1

0.76

0.99

1.40

0.030

0.039

0.055

C

0.20

0.25

0.36

0.008

0.01

0.014

D

27.43

27.94

28.45

1.08

1.10

1.12

E

10.16

10.41

11.05

0.400

0.410

0.435

E1

8.38

8.64

9.40

0.330

0.340

0.370

e

1.778

0.070

e1

10.16

0.400

L

2.54

3.30

3.81

0.10

0.13

0.15

M0

°(min.), 15°(max.)

S

0.31

0.012

OUTLINE AND

MECHANICAL DATA

Outline and mechanical data

SDIP30 (0.400 in.)