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STP38N06 数据表(PDF) 3 Page - STMicroelectronics |
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STP38N06 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 11 page ![]() ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON Symb ol Parameter Test Cond ition s Mi n. Typ . Max. Un it td(on) tr Turn-on T ime Rise Time VDD =30 V ID =19 A RG =50 Ω VGS =10 V (see t est circuit, figure 3) 45 280 65 380 ns ns (di/ dt)on Turn-on Current Slope VDD =48 V ID =38 A RG =50 Ω VGS =10 V (see t est circuit, figure 5) 240 A/ µs Qg Qgs Qgd Total Gat e Charge Gate-Source Charge Gate-Drain Charge VDD =40 V ID =38 A VGS =10 V 60 10 20 80 nC nC nC SWITCHING OFF Symb ol Parameter Test Cond ition s Mi n. Typ . Max. Un it tr(Voff) tf tc Of f-voltage Rise Time Fall T ime Cross-over T ime VDD =48 V ID =38 A RG =50 Ω VGS =10 V (see t est circuit, figure 5) 65 140 230 85 180 300 ns ns ns SOURCE DRAIN DIODE Symb ol Parameter Test Cond ition s Mi n. Typ . Max. Un it ISD ISDM ( •) Source-drain Current Source-drain Current (pulsed) 38 152 A A VSD ( ∗)Forward On Voltage ISD =38 A VGS =0 1.5 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 38 A di/ dt = 100 A/ µs VDD =40 V Tj = 150 oC (see t est circuit, figure 5) 85 0.3 7 ns µC A ( ∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % ( •) Pulse width limited by safe operating area (1)ISD ≤ 20 A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS,Tj ≤ TJMAX Safe Operating Area Thermal Impedance STP38N06 3/11 |
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