QST108AT0 datasheet(45/51 Pages) STMICROELECTRONICS

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QST108

Package mechanical data

45/51

7.1

Soldering information

In accordance with the RoHS European directive, all STMicroelectronics packages have

been converted to lead-free technology, named ECOPACK™.

●

ECOPACK™ packages are qualified according to the JEDEC STD-020C compliant

soldering profile.

●

Detailed information on the STMicroelectronics ECOPACK™ transition program is

available on www.st.com/stonline/leadfree/, with specific technical Application notes

covering the main technical aspects related to lead-free conversion (AN2033, AN2034,

AN2035, and AN2036).

Backward and forward compatibility

The main difference between Pb and Pb-free soldering process is the temperature range.

●

ECOPACK™ LQFP, SDIP, SO and DFN8 packages are fully compatible with Lead (Pb)

containing soldering process (see application note AN2034).

●

LQFP, SDIP and SO Pb-packages are compatible with Lead-free soldering process,

nevertheless it's the customer's duty to verify that the Pb-packages maximum

temperature (mentioned on the Inner box label) is compatible with their Lead-free

soldering temperature.

Table 37.

Soldering Compatibility (wave and reflow soldering process

Package

Plating material devices

Pb solder paste Pb-free solder paste (1)

Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is

compatible with their Lead-free soldering process.

SDIP & PDIP

Sn (pure Tin)

Yes

DFN8

Sn (pure Tin)

Yes

TQFP and SO

NiPdAu (Nickel-palladium-Gold)

Yes

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