Package mechanical data

STV6412B

30/32

6.1

Environment

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

E1

13.80

14.00

14.201

0.543

0.551

0.559

E3

12.00

0.472

L

0.45

0.60

0.75

0.018

0.024

0.030

L1

1.00

0.039

Degrees

k

0° minimum 3.5° typical 7° maximum

Table 26.

LQFP64 package dimensions (continued)