Package mechanical data

STV6414A

30/32

6.1

Lead-free packaging

To meet environmental requirements, ST offers these devices in ECOPACK® packages.

These packages have a lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

E3

7.50

0.295

e

0.50

0.019

L

0.45

0.60

0.75

0.017

0.023

0.029

L1

1.00

0.039

Degrees

K

0° minimum 3.5° typical 7° maximum

Table 27.

LQFP64 package dimensions (continued)

Dimension

Millimeters

Inches

Minimum

Typical

Maximum

Minimum

Typical

Maximum