TSL1020

Package information

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4

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

Table 4.

TQFP48 ePad package mechanical data

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A1.20

0.047

A1

0.05

0.15

0.002

0.006

A2

0.95

1.00

1.05

0.037

0.039

0.041

b

0.17

0.22

0.27

0.007

0.009

0.011

c

0.09

0.20

0.004

0.008

D

8.80

9.00

9.20

0.346

0.354

0.362

D1

6.80

7.00

7.20

0.268

0.276

0.283

D2

2.00

0.079

D3

5.50

0.217

E

8.80

9.00

9.20

0.346

0.354

0.362

E1

6.80

7.00

7.20

0.268

0.276

0.283

E2

2.00

0.079

E3

5.50

0.217

e

0.50

0.020

L

0.45

0.60

0.75

0.018

0.024

0.030

L1

1.00

0.039

k

0°3.5°7°

0°

3.5°

7°

ccc

0.08

0.003