STP9NK50Z - STP9NK50ZFP - STB9NK50Z

2/12

ABSOLUTE MAXIMUM RATINGS

(

(*) Limited only by maximum temperature allowed

THERMAL DATA

AVALANCHE CHARACTERISTICS

GATE-SOURCE ZENER DIODE

PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES

The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s

ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be

applied from gate to souce. In this respect the Zener voltage is appropriate to achieve an efficient and cost-

effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage

of external components.

Symbol

Parameter

Value

Unit

STP9NK50Z

STB9NK50Z

STP9NK50ZFP

500

V

500

V

Gate- source Voltage

± 30

V

7.2

7.2 (*)

A

4.5

4.5 (*)

A

Drain Current (pulsed)

28.8

28.8 (*)

A

110

30

W

Derating Factor

0.88

0.24

W/°C

Gate source ESD(HBM-C=100pF, R=1.5K

Ω)

3500

V

dv/dt (1)

Peak Diode Recovery voltage slope

4.5

V/ns

Insulation Withstand Voltage (DC)

-

2500

V

Operating Junction Temperature

Storage Temperature

-55 to 150

-55 to 150

°C

°C

TO-220

TO-220FP

Rthj-case

Thermal Resistance Junction-case Max

1.14

4.2

°C/W

Rthj-amb

Thermal Resistance Junction-ambient Max

62.5

°C/W

Maximum Lead Temperature For Soldering Purpose

300

°C

Symbol

Parameter

Max Value

Unit

Avalanche Current, Repetitive or Not-Repetitive

7.2

A

Single Pulse Avalanche Energy

190

mJ

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Gate-Source Breakdown

Voltage

Igs=± 1mA (Open Drain)

30

V