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STPIC6A259 数据表(PDF) 4 Page - STMicroelectronics

部件名 STPIC6A259
功能描述  POWER LOGIC 8-BIT ADDRESSABLE LATCH
PDF  13 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STPIC6A259 数据表(HTML) 4 Page - STMicroelectronics

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DC CHARACTERISTICS (VCC=5V, TC= 25°C, unless otherwise specified.)
SWITCHING CHARACTERISTICS (VCC=5V, TC= 25°C, unless otherwise specified.)
Note 1: All Voltage valuea are with respect to LGND and PGND
Note 2: Each power DMOS source is internally connected to GND
Note 3: Pulse duration
≤ 100ms and duty cycle ≤ 2%
Note 4: Drain Supply Voltage = 15V, starting junction temperature (TJS) = 25°C. L = 210µH and IAS = 600mA (See Fig. 6)
Note 5: Technique should limit TJ - TC to 10°C maximum
Note 6: These parameters are measured with voltage sensing contacts separate from the current-carrying contacts.
Note 7: Nominal Current is defined for a consistent comparison between devices from different sources. It is the current that produces a
voltage drop of 0.5V at TC = 85°C.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V(BR)DSX Drain-to-Source breakdown
Voltage
ID = 1mA
50
V
VSD
Source-to-Drain Diode
Forward Voltage
IF = 350 mA (See Note 3)
0.8
1.1
V
IIH
High Level Input Current
VI = VCC
1
µA
IIL
Low Level Input Current
VI = 0
-1
µA
ICC
Logic Supply Current
IO = 0
0.5
5
mA
IOK
Output Current at Which
Chopping Starts
TC = 25°C
(See Note 3 and Figg.
3, 4)
0.6
0.8
1.1
A
I(nom)
Nominal Current
VDS(on) = 0.5V
I(nom) = ID
VCC = 5V
TC=85°C
(See Note 5, 6, 7)
350
mA
ID
Off-State Drain Current
VDS = 40V
TC=25°C
0.1
1
µA
VDS = 40V
TC=125°C
0.2
5
µA
RDS(on)
Termination Resistance
(See Note 5, 6 and figg. 9,
10)
ID = 350mA
TC=25°C
1
1.5
ID = 350mA
TC=125°C
1.7
2.5
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
tPHL
Propagation Dealy Time,
High to Low Level Output
from D
CL = 30pF
ID = 350mA
(See Figg. 1, 2, 11)
30
ns
tPLH
Propagation Dealy Time,
Low to High Level Output
from D
125
ns
tr
Rise Time, Drain Output
60
ns
tf
Fall Time, Drain Output
30
ns
ta
Reverse Recovery Current
Rise Time
IF = 350mA
di/dt = 20A/
µs
(See Note 5, 6 and Fig. 5)
100
ns
trr
Reverse Recovery Time
300
ns



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