0

10

203040

50607080

90

100

100

120

140

160

180

200

220

240

260

280

300

S(Cu) (mm )

Rth(j-a) (

°C/W)

IF=1A

Fig. 9: Thermal resistance junction to ambient

versus copper surface (epoxy printed circuit board

FR4, copper thickness: 35

µm).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

VFM(V)

IFM(A)

Tj=100

°C

Tj=25

°C

Tj=150

°C

Fig. 8-2: Forward voltage drop versus forward

current (low level, maximum values).

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

1E-2

1E-1

1E+0

5E+0

VFM(V)

IFM(A)

Tj=100

°C

Tj=25

°C

Tj=150

°C

Fig. 8-1: Forward voltage drop versus forward

current (high level, maximum values).

STPS140Z

4/5