1E-3

1E-2

1E-1

1E+0

0

1

2

3

4

5

6

7

8

t(s)

IM(A)

Ta=25°C

Ta=50°C

Ta=100°C

t

δ=0.5

Fig. 3-1: Non repetive surge peak forward current

versus overload duration (maximum values) (SMB).

1E-3

1E-2

1E-1

1E+0

0

1

2

3

4

5

6

7

8

Ta=25°C

Ta=50°C

Ta=100°C

t(s)

IM(A)

t

δ=0.5

Fig. 3-2: Non repetive surge peak forward current

versus overload duration (maximum values) (SMA).

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

tp(s)

Zth(j-a)/Rth(j-a)

δ=0.1

δ=0.2

δ=0.5

Single pulse

Printed circuit board: S(Cu)=1.5cm² (e=35µm)

T

tp

Fig. 4-1: Relative variation of thermal impedance

junction to ambient versus pulse duration (SMB).

1E-2

1E-1

1E+0

1E+1

1E+2

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

tp(s)

Zth(j-a)/Rth(j-a)

δ=0.1

δ=0.2

δ=0.5

Single pulse

T

tp

Printed circuit board: S(Cu)=1.5cm² (e=35µm)

Fig. 4-2: Relative variation of thermal impedance

junction to ambient versus pulse duration (SMA).

0

5

10 15 20 25 30 35 40 45 50 55 60

1E-1

1E+0

1E+1

1E+2

1E+3

VR(V)

IR(µA)

Tj=100°C

Tj=75°C

Tj=25°C

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

1

2

5

10

20

50

100

10

20

50

100

200

VR(V)

C(pF)

F=1MHz

Tj=25°C

Fig. 6: Junction capacitance versus reverse volt-

age applied (typical values)

STPS160A/U

3/6