0

5

10

15

20

25

30

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

IR(mA)

Tj=125°C

Tj=25°C

Tj=100°C

Tj=150°C

VR(V)

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

12

5

10

20

30

10

100

500

C(pF)

F=1MHz

Tj=25°C

VR(V)

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.01

0.10

1.00

10.00

IFM(A)

Typical values

Tj=150°C

Tj=125°C

Tj=25°C

Tj=100°C

VFM(V)

Fig. 7-1: Forward voltage drop versus forward cur-

rent (maximum values, high level).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.10

1.00

10.00

IFM(A)

Tj=150°C

Tj=125°C

Tj=25°C

VFM(V)

Fig. 7-2: Forward voltage drop versus forward cur-

rent (typical values, low level).

0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

0.0

0.5

1.0

1.5

2.0

2.5

3.0

IFM(A)

Typical values

Tj=150°C

Tj=125°C

Tj=25°C

Tj=100°C

VFM(V)

Fig. 7-3: Forward voltage drop versus forward cur-

rent (maximum values, low level).

01

2345

0

20

40

60

80

100

120

140

Rth(j-a) (°C/W)

S(Cu) (cm²)

Fig. 8: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, copper thickness:

STPS2L30A

3/4