STPS1L40A/U

4/5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0

20

40

60

80

100

120

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 10: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, copper thickness

s(Cu) = 35µm)

0

50

100 150 200 250 300 350 400 450 500

0.0

0.5

1.0

1.5

2.0

2.5

3.0

VFM(mV)

IFM(A)

Tj=25°C

Tj=125°C

(typical values)

Tj=125°C

Fig. 9-2: Forward voltage drop versus forward

current (maximum values, low level).

10.00

0

50 100 150 200 250 300 350 400 450 500 550 600 650 700

0.01

0.10

1.00

VFM(mV)

IFM(A)

Tj=125°C

Tj=125°C

(typical

values)

Tj=25°C

Fig. 9-1: Forward voltage drop versus forward

current (maximum values, high level).