STPS2L60/A

4/6

R

(°C/W)

th(j-)

0

10

20

30

40

50

60

70

80

90

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(Cu)(cm²)

Fig. 11-1: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, Cu: 35µm) (SMA).

0

10

20

30

40

50

60

70

80

90

100

012

34567

89

10

R

(°C/W)

th(j-)

S(Cu)(cm²)

Fig. 11-2: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, Cu: 35µm) (DO-41).

I (µA)

R

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

0

102030

405060

V (V)

R

T =125°C

j

T =150°C

j

T =100°C

j

T =75°C

j

T =50°C

j

T =25°C

j

Fig. 7: Reverse leakage current versus reverse

voltage applied (typical values).

C(pF)

10

100

1000

1

10

100

F=1MHz

V

=30mV

T =25°C

OSC

j

V (V)

R

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values).

I

(A)

FM

0

1

2

3

4

5

6

7

8

9

10

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

V

(V)

FM

T =25°C

(maximum values)

j

T =125°C

(maximum values)

j

T =125°C

(typical values)

j

Fig. 9: Forward voltage drop versus forward

current (low level, maximum values).

R (°C/W)

th

0

20

40

60

80

100

120

5

10152025

L

(mm)

leads

Fig. 10: Thermal resistance versus lead length

(DO-41).