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IRF630MFP 数据表(PDF) 4 Page - STMicroelectronics |
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IRF630MFP 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 14 page ![]() Electrical characteristics IRF630M - IRF630MFP 4/14 2 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage ID = 250µA, VGS = 0 200 V IDSS Zero gate voltage drain current (VGS = 0) VDS = max rating VDS = max rating, TC = 125 °C 1 50 µA µA IGSS Gate-body leakage current (VDS = 0) VGS = ± 20V ±100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250µA 2 3 4 V RDS(on) Static drain-source on resistance VGS = 10V, ID = 4.5A 0.35 0.40 Ω Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit gfs (1) 1. Pulsed: pulse duration = 300µs, duty cycle 1.5% Forward transconductance VDS > ID(on) x RDS(on)max, ID =4.5A 34 S Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance VDS = 25V, f = 1 MHz, VGS = 0 540 90 35 700 pF pF pF td(on tr tr(Voff) tf Turn-on delay time Rise time Off-voltage rise time Fall time VDD = 100V, ID = 4.5A RG =4.7Ω VGS = 10V 10 15 12 12 14 20 17 17 ns ns ns ns Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = 160V, ID = 9A, VGS = 10V 31 7.5 9 45 nC nC nC |
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