MPX5100

Sensors

6

Freescale Semiconductor

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluoro silicone gel

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using Table 3

below.

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder

Figure 5. Small Outline Package Footprint

TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Part Number

Case Type

Pressure (P1) Side Identifier

MPX5100A, MPX5100D

867

Stainless Steel Cap

MPX5100DP

867C

Side with Part Marking

MPX5100AP, MPX5100GP

867B

Side with Port Attached

MPX5100GSX

867F

Side with Port Attached

MPXV5100GC6U

482A

Side with Port Attached

MPXV5100GC7U

482C

Side with Port Attached

MPXV5100DP

1351

Side with Part Marking

MPXV5100GP

1369

Side with Port Attached