STPS3L25S datasheet(3/4 Pages) STMICROELECTRONICS

3 / 4 page

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

IR(mA)

Tj=125°C

Tj=25°C

Tj=100°C

Tj=150°C

VR(V)

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

100

500

VR(V)

C(pF)

F=1MHz

Tj=25°C

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

IFM(A)

Typical values

Tj=150°C

Tj=25°C

Tj=100°C

Tj=125°C

VFM(V)

Fig. 7-1: Forward voltage drop versus forward

current (maximum values, high level).

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

100

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 8: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, copper thickness:

0.1

0.2

0.3

0.4

0.5

0.6

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

IFM(A)

Typical values

Tj=150°C

Tj=25°C

Tj=100°C

Tj=125°C

VFM(V)

Fig. 7-2: Forward voltage drop versus forward

current (maximum values, low level).

STPS3L25S

3/4

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