STPS3L40S

3/4

0

5

10

15

20

25

30

35

40

1E-3

1E-2

1E-1

1E+0

1E+1

5E+1

VR(V)

IR(mA)

Tj=125°C

Tj=100°C

Tj=25°C

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.01

0.10

1.00

10.00

50.00

VFM(V)

IFM(A)

Tj=125°C

(Typical values)

Tj=25°C

Tj=125°C

Fig. 7: Forward voltage drop versus forward

current (maximum values).

12

5

10

20

40

10

100

600

VR(V)

C(pF)

F=1MHz

Tj=25°C

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

1

10

100

1000

0

10

20

30

40

50

60

70

80

Number of cycles

IFSM(A)

F=50Hz

Tj initial=25°C

Fig. 8: Non repetitive surge peak forward current

versus number of cycles.

0123

45

0

20

40

60

80

100

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 9: Thermal resistance junction to ambient

versus copper surface under tab (Epoxy printed

circuit board FR4, copper thickness: 35

µm).