12

5

10

20

50

10

20

50

100

200

500

VR(V)

C(pF)

F=1MHz

Tj=25°C

Fig. 6: Junction capacitance versus reverse

voltage applied (Typical values).

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

0.01

0.10

1.00

10.00

IFM(A)

Typical values

Tj=150°C

Tj=125°C

VFM(V)

Fig. 7: Forward voltage drop versus forward

current (Maximum values).

0

5

10

15

20

25

30

35

40

1E-5

1E-4

1E-3

1E-2

VR(V)

IR(A)

Tj=125°C

Tj=100°C

Tj=75°C

Tj=150°C

Fig. 5: Reverse leakage current versus reverse

voltage applied (Typical values).

0

1

234

5

0

20

40

60

80

100

120

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 8-1: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy printed

circuit board FR4, copper thickness: 35

µm) (SMB).

01

2345

0

20

40

60

80

100

Rth(j-a) (°C/W)

S(Cu) (cm²)

Fig. 8-2: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy printed

circuit board FR4, copper thickness: 35

µm) (SMC).

02468

10

12

14

16

18

20

0

20

40

60

80

100

Rth(j-a) (°C/W)

S(Cu) (cm²)

Fig. 8-3: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy printed

circuit board FR4, copper thickness: 35

µm) (DPAK).

STPS340U/S/B

4/7