1E-3

1E-2

1E-1

1E+0

0

20

40

60

80

100

120

IM(A)

Tc=25

°C

Tc=125

°C

Tc=75

°C

t

δ=0.5

t(s)

Fig. 3: Non repetitive surge peak forward current

versus overload duration (maximum values).

1E-4

1E-3

1E-2

1E-1

1E+0

0.0

0.2

0.4

0.6

0.8

1.0

tp(s)

Zth(j-c)/Rth(j-c)

T

tp

Single pulse

δ = 0.1

δ = 0.2

δ = 0.5

Fig. 4: Relative variation of thermal impedance

junction to ambient versus pulse duration.

0

5

10

15

20

25

30

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

3E+2

IR(mA)

Tj=125

°C

Tj=25

°C

Tj=150

°C

VR(V)

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

110

40

100

200

500

1000

2000

VR(V)

C(pF)

F=1MHz

Tj=25

°C

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

0.0

0.2 0.4

0.6 0.8

1.0

1.2 1.4

1.6 1.8

2.0

0.1

1.0

10.0

100.0

VFM(V)

IFM(A)

Typical values

Tj=150

°C

Tj=25

°C

Tj=125

°C

Fig. 7: Forward voltage drop versus forward cur-

rent (maximum values).

0

2468

10

12

14

16

18

20

0

20

40

60

80

100

S(Cu) (cm )

Rth(j-a) (

°C/W)

Fig. 8: Thermal resistance junction to ambient ver-

sus copper surface under tab (Epoxy printed circuit

board FR4, copper thickness: 35

µm).

STPS8L30B

3/4