1

10

100

100

200

500

1000

VR(V)

C(nF)

F=1MHz

Tj=25

°C

Fig. 6: Junction capacitance versus reverse volt-

age applied (typical values).

0

4

8

121620

2428

3236

40

0

10

20

30

40

50

60

70

80

S(Cu) (cm )

Rth(j-a) (

°C/W)

Fig. 8: Thermal resistance junction to ambient ver-

sus copper surface under tab (Epoxy printed circuit

board FR4, copper thickness: 35

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

0.1

1.0

10.0

50.0

VFM(V)

IFM(A)

Tj=25

°C

Tj=125

°C

Fig. 7: Forward voltage drop versus forward cur-

rent (maximum values).

STPS8H100D/F/G/G-1

4/7