0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

1E-2

1E-1

1E+0

1E+1

5E+1

IFM(A)

Tj=125°C

Tj=25°C

VFM(V)

Fig. 9: Forward voltage drop versus forward

current (maximum values).

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2 5E+2

1E-2

1E-1

1E+0

Zth(j-a) (°C/W)

tp(s)

δ = 0.1

δ = 0.2

δ = 0.5

Single pulse

T

tp

Fig. 10: Relative variation of thermal impedance

junction

to

ambient

versus

pulse

duration

(recommended pad layout).

0

20

40

60

80

100 120 140 160 180 200

0

50

100

150

200

250

300

trr(ns)

VR=400V

Tj=125°C

IF=2*IF(av)

IF=IF(av)

dIF/dt(A/µs)

Fig. 12: Reverse recovery time versus dIF/dt (90%

confidence).

0

50

100

150

200

0

1

2

3

4

5

6

7

8

9

10

IRM(A)

VR=400V

Tj=125°C

IF=2*IF(av)

IF=IF(av)

dIF/dt(A/µs)

Fig. 11: Peak reverse recovery current versus

dIF/dt (90% confidence).

25

50

75

100

125

0.7

0.8

0.9

1.0

1.1

IRM

S factor

Tj(°C)

Fig. 14: Relative variation of dynamic parameters

versus junction temperature (reference Tj=125°C).

0

20

40

60

80

100

120

140

160

180

200

0.6

0.8

1.0

1.2

1.4

1.6

1.8

S factor

IF<2*IF(av)

VR=400V

Tj=125°C

dIF/dt(A/µs)

Fig. 13: Softness factor (tb/ta) versus dIF/dt

(typical values).

STTA206S

6/8