0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

IF(av)(A)

PF(av)(W)

T

tp

δ = 1

δ = 0.5

δ = 0.2

δ = 0.1

δ = 0.05

Fig. 1: Power dissipation versus average forward

current.

0

25

50

75

100

125

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

Tamb(°C)

IF(av)(A)

Rth(j-a)=Rth(j-l)

Rth(j-a)=75°C/W

T

tp

Fig. 2: Average forward current versus ambient

temperature (

δ=0.5).

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

1E-3

1E-2

1E-1

1E+0

tp(s)

K=[Zth(j-a)/Rth(j-a)]

T

tp

Single pulse

δ = 0.1

δ = 0.2

δ = 0.5

Fig. 3: Relative variation of thermal impedance

junction to ambient versus pulse duration (epoxy

printed circuit board, e(Cu)=35

µm), recommended

pad layout).

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

0

1

2

3

4

5

VFM(V)

IFM(A)

Tj=125°C

Maximum values

Tj=125°C

Typical values

Tj=25°C

Maximum values

Fig. 4-1: Forward voltage drop versus forward

current (low level).

0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0

1

10

50

VFM(V)

IFM(A)

Tj=125°C

Typical values

Tj=125°C

Maximum values

Tj=25°C

Maximum values

Fig 4-2 : Forward voltage drop versus forward

current (high level).

STTA406

3/5