STTH112/A/U

3/6

Z/R

th(j-c)

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

T

tp

t (s)

p

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3-1: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

Z/R

th(j-c)

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

T

tp

t (s)

p

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3-2: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

FR4) (SMA).

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

012

34567

89

10

S(cm²)

DO-41

L

=10mm

leads

SMB

Fig. 4-1: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy

printed circuit board FR4, copper thickness: 35µm)

(DO-41, SMB).

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

SMA

Fig. 4-2: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy

printed circuit board FR4, copper thickness: 35µm)

(SMA).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-c)

th(j-c)

T

tp

t (s)

p

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3-3: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

FR4)(SMB).