STTH1L06/U/A

5/8

1

10

100

1

10

100

1000

VR(V)

F=1MHz

Vosc=30mV

Tj=25°C

C(pF)

Fig. 11:

Junction capacitance versus reverse

voltage applied (typical values).

0

10

20

30

40

50

60

70

80

90

100

110

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10

S(cm²)

DO-41

Lleads=10mm

SMB

Rth(j-a)(°C/W)

Fig. 12-1: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, copper thickness: 35µm).

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

SMA

Rth(j-a)(°C/W)

Fig. 12-2: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, copper thickness: 35µm).