STTH310/S

3/5

P(W)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

I

(A)

F(AV)

T

tp

δ = 1

δ = 0.05

δ = 0.5

δ = 0.2

δ = 0.1

Fig. 1: Conduction losses versus average current.

I

(A)

FM

0.1

1.0

10.0

100.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

T =25°C

(maximum values)

j

V

(V)

FM

T =150°C

(maximum values)

j

T =150°C

(typical values)

j

Fig. 2: Forward voltage drop versus forward

current

.

Z/R

th(j-c)

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

T

tp

t (s)

p

Fig. 3-1: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

Z/R

th(j-c)

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

T

tp

t (s)

p

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3-2: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

FR4, S=1cm

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

012

345

SMB

DO-201AD

L

=10mm

leads

S(cm²)

Fig. 4: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy

printed circuit board FR4, copper thickness:

35µm).