AD9958SLASHPCBZ datasheet(44/44 Pages) AD

44 / 44 page

AD9958

Rev. A | Page 44 of 44

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2

PIN 1

INDICATOR

TOP

VIEW

7.75

BSC SQ

8.00

BSC SQ

6.25

6.10 SQ

5.95

0.50

0.40

0.30

0.23

0.18

0.50 BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

6.50

REF

SEATING

PLANE

0.60 MAX

PIN 1

INDICATOR

COPLANARITY

0.08

0.05 MAX

0.02 NOM

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

THE EXPOSED EPAD ON BOTTOM SIDE

OF PACKAGE IS AN ELECTRICAL

CONNECTION AND MUST BE

SOLDERED TO GROUND.

Figure 50. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

8 mm × 8 mm Body, Very Thin Quad

(CP-56-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD9958BCPZ1

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-56-1

AD9958BCPZ-REEL71

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-56-1

AD9958/PCBZ1

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D05252-0-7/08(A)

AD9958/PCBZ 数据表(PDF) 44 Page - Analog Devices

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