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STW26NM50 数据表(PDF) 3 Page - STMicroelectronics |
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STW26NM50 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 9 page ![]() 3/9 STW26NM50 Table 7: On /Off Table 8: Dynamic Table 9: Source Drain Diode (1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. (2) Pulse width limited by safe operating area. (3) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID = 250 mA, VGS = 0 500 V IDSS Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating VDS = Max Rating, TC = 125°C 10 100 µA µA IGSS Gate-body Leakage Current (VDS = 0) VGS = ± 20 V ± 10 µA VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 3 4 5V RDS(on Static Drain-source On Resistance VGS = 10 V, ID = 13 A 0.10 0.12 Ω Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (1) Forward Transconductance VDS = 15 V , ID = 13 A 20 S Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, f = 1 MHz, VGS = 0 3000 700 50 pF pF pF COSS eq (3). Equivalent Output Capacitance VGS = 0 V, VDS = 0 to 400 V 300 pF td(on) tr td(off) tf Turn-on Delay Time Rise Time Turn-off-Delay Time Fall Time VDD = 250 V, ID = 13 A, RG = 4.7 Ω, VGS = 10 V (see Figure 15) 28 15 13 19 ns ns ns ns Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = 400 V, ID = 26 A, VGS = 10 V (see Figure 18) 76 20 36 106 nC nC nC Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD ISDM (2) Source-drain Current Source-drain Current (pulsed) 26 104 A A VSD (1) Forward On Voltage ISD = 26 A, VGS = 0 1.5 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 26 A, di/dt = 100 A/µs VDD = 100V (see Figure 16) 400 5.5 27.8 ns µC A trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 26 A, di/dt = 100 A/µs VDD = 100V, Tj = 150°C (see Figure 16) 492 7 28.8 ns µC A |
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