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H8SX/1663M 数据表(PDF) 1397 Page - Renesas Technology Corp |
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H8SX/1663M 数据表(HTML) 1397 Page - Renesas Technology Corp |
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1397 / 1504 page ![]() Section 30 Electrical Characteristics Rev. 2.00 Sep. 24, 2008 Page 1365 of 1468 REJ09B0412-0200 Item Symbol Min. Typ. Max. Unit Test Conditions During A/D and D/A conversion 0.5 1.0 mA Reference power supply current Standby for A/D and D/A conversion AI CC 0.5 1.0 µA RAM standby voltage V RAM 2.5 V V cc rising gradient* 6 SV CC 20 ms/V Notes: 1. When the A/D and D/A converters are not used, the AV CC, Vref, and AVSS pins should not be open. Connect the AV CC and Vref pins to VCC, and the AVSS pin to VSS. 2. Current consumption values are for V IHmin = Vcc − 0.5 V and VILmax = 0.5 V with all output pins unloaded and all input pull-up MOS in the off state. 3. The values are for V RAM ≤ VCC < 3.0 V, VIHmin = VCC × 0.9, and VILmax = 0.3 V. 4. I CC depends on f as follows: I CCmax = 30 (mA) + 1.1 (mA/MHz) × f (normal operation) I CCmax = 35 (mA) + 0.5 (mA/MHz) × f (sleep mode) 5. The values are for reference. 6. This can be applied at power-on. 7. The value when TM 32K halted. |
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