STF4LNK60Z datasheet(3/11 Pages) STMICROELECTRONICS

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STD4LNK60Z - STF4LNK60Z

Electrical ratings

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Electrical ratings

Table 2.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

TO-220FP

DPAK

VDS

Drain-source voltage (VGS = 0)

600

VGS

Gate-source voltage

± 30

Drain current (continuous) at TC = 25 °C

3.3 (1)

Limited by package

3.3

Drain current (continuous) at TC = 100 °C

2 (1)

IDM

Drain current (pulsed)

13.2(1)

13.2

PTOT

Total dissipation at TC = 25 °C

Derating factor

0.2

0.56

W/°C

VISO

Insulation withstand voltage (RMS) from all

three leads to external heat sink

(t=1 s;TC=25 °C)

2500

Tstg

Operating junction temperature

Storage temperature

-55 to 150

°C

Table 3.

Thermal data

Symbol

Parameter

Value

Unit

TO-220FP

DPAK

Rthj-case

Thermal resistance junction-case

1.79

°C/W

Rthj-pcb

Thermal resistance junction-pcb(1)

Minimum footprint

°C/W

Rthj-amb

Thermal resistance junction-amb

62.5

°C/W

Maximum lead temperature for soldering

purpose

300

°C

Table 4.

Avalanche characteristics

Symbol

Parameter

Value

Unit

IAR

Avalanche current, repetitive or not

repetitive (pulse width limited by Tjmax)

TBD

EAS

Single pulse avalanche energy (1)

Starting Tj = 25 °C, ID = IAR, VDD = 50 V

TBD

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