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TDA2004 数据表(PDF) 7 Page - STMicroelectronics |
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TDA2004 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 10 page ![]() Figure 17 : Total Power Dissipation and Efficiency vs. Output Power . APPLICATION SUGGESTION The recommended values of the componentsare those shown on application circuit of fig.1. Different values can be used ; the following table can help the designer. Component Recomm. Value Purpose Larger Than Smaller Than R1 120K Ω Optimization of the output signal simmetry Smaller PO max. Smaller PO max. R2, R4 1K Ω Close loop gain setting (*) Increase of gain Decrease of gain R3, R5 3.3 Ω Decrease of gain Increase of gain R6, R7 1 Ω Frequency stability Danger of oscillation at high frequency with inductive load C1, C2 2.2 µF Input DC decoupling High turn-on delay High turn-on pop Higher low frequency cutoff. Increase of noise C3 10 µF Ripple Rejection Increase of SVR. Increase of the switch- on time. Degradation of SVR. C4, C6 100 µF Boostrapping Increase of distortion at low frequency C5, C7 100 µF Feedback Input DC decoupling. C8, C9 0.1 µF Frequency Stability Danger of oscillation. C10, C11 1000 µF to 2200µF Output DC decoupling. Higher low-frequency cut-off. (*) The closed–loop gain must be higher than 26dB. TDA2004A 7/10 |
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