Document Number: 20033

For technical questions, contact: ww2bresistors@vishay.com

www.vishay.com

Revision: 18-Nov-08

39

WSL....E

Patents Pending

Vishay Dale

DIMENSIONS

Pulse Energy Plot:

This represents the energy in each of 50 pulses, with a

1 second rest between pulses, that it takes to shift the

L

T

d

D

W

I

a

b

SIZE

INCH

Dimensions in inches [millimeters]

L

D

d

1506

0.15 ± 0.005

[3.81 ± 0.13]

0.062 ± 0.003

[1.57 ± 0.08]

0.025

[0.64]

0.012 ± 0.003

[0.30 ± 0.08]

0.059 ± 0.003

[1.50 ± 0.08]

2010

0.200 ± 0.005

[5.08 ± 0.13]

0.100 ± 0.003

[2.54 ± 0.08]

0.025

[0.64]

0.020 ± 0.003

[0.51 ± 0.08]

0.097 ± 0.003

[2.46 ± 0.08]

2512

0.250 ± 0.005

[6.35 ± 0.13]

0.126 ± 0.003

[3.20 ± 0.08]

0.025

[0.64]

0.024 ± 0.003

[0.61 ± 0.08]

0.123 ± 0.003

[3.12 ± 0.08]

SIZE

INCH

Solder Pad Dimensions in inches [millimeters]

ab

l

1506

0.015 [0.38]

0.062 [1.57]

0.118 [3.00]

2010

0.023 [0.58]

0.100 [2.54]

0.153 [3.89]

2512

0.027 [0.69]

0.126 [3.20]

0.196 [4.98]

Pulse Energy

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+02

1.E+03

1.E+04

1.E+05

Time in Microseconds

WSL2512E

WSL1506E

WSL2010E

0

0.25

0.50

0.75

1.0

Power in W

WSL1506E

WSL2010E

WSL2512E

150

125

100

75

50

25

0

Temperature Rise

- 55

- 25

0

25

50

75

100

125

150 175

Ambient Temperature in °C

120

100

80

60

40

20

0

70

Derating

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS

Thermal Shock

- 55 °C to + 150 °C, 100 cycles, 15 min at each extreme

± (0.20 % + 0.01

Ω)

Short Time Overload

5 x rated power for 5 s

± (0.20 % + 0.01

Ω)

Low Temperature Storage

- 65 °C for 24 h

± (0.20 % + 0.01

Ω)

High Temperature Exposure

1000 h at + 150 °C

± (0.50 % + 0.01

Ω)

Moisture Resistance

MIL-STD-202, Method 106, 0 % power, 7a and 7b not required

± (0.50 % + 0.01

Ω)

Load Life

1000 h at rated power, + 70 °C, 1.5 h “ON”, 0.5 h “OFF”

± (0.50 % + 0.01

Ω)

Vibration

MIL-STD-202, Method 204D

± (0.10 % + 0.01

Ω)

Mechanical Shock

100 g’s for 6 ms, 5 pulses

± (0.10 % + 0.01

Ω)

Resistance to Soldering Heat

+ 260 °C Solder, 10 - 12 s dwell, 25 mm/s emergence

± (0.50 % + 0.01

Ω)