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TDA2170 数据表(PDF) 6 Page - STMicroelectronics |
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TDA2170 数据表(HTML) 6 Page - STMicroelectronics |
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6 / 7 page ![]() TYPICAL PERFORMANCES Parameter 110 ° TVC 5.9 Ω /10mH 110 ° TVC 9.6 Ω /27mH 90 ° TVC 15 Ω /30 mH Unit Vs – Supply Voltage 24 22.5 25 V Is – Current 280 175 125 mA tfly – Flyback Time 0.6 1 0.7 ms *Ptot – Power Dissipation 4.2 2.5 2.05 W *Rth c–a – Heatsink 7 13 16 °C/W Tamb 60 60 60 °C Tj max 110 110 110 °C to 20 20 20 ms Vi 2.5 2.5 2.5 VPP V7 50 47 52 VP * Worst case condition. MOUNTING INSTRUCTIONS The power dissipated in the circuit must be re- moved by adding an external heatsink. Thanks to the MULTIWATT ® package attaching the heatsink is very simple, a screw or a compres- sion spring (clip) being sufficient. Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces. Figure 2 : Application Circuit Figure 5 : Maximum Allowable Power Dissipation versus Ambient Temperature TDA2170 6/7 |
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