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TDA7245 数据表(PDF) 9 Page - STMicroelectronics |
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TDA7245 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 11 page ![]() THERMAL SHUTDOWN The presence of a thermal limiting circuit offers the following advantages: 1)An overload on the output (even if it is perma- nent), or an above limit ambient temperature can be easily tolerated since the Tj cannot be higher than 150 °C. 2)The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device dam- age due to high junction temperature. If for any reason, the junction temperature in- crease up to 150 °C, the thermal shutdown simply reduces the power dissipation and the current consumption. The maximum allowable power dissipation de- pends upon the junction-ambient thermal resis- tance. Fig. 21 shows this dissipable power as a function of ambient temperature for different ther- mal resistance. Figure 21: Maximum Allowable Power Dissipation vs. Ambient Temperature Figure 22: Example of Heatsink using PC Board Copper (l = 65mm) MOUNTING INSTRUCTIONS The TDA7245 is assembled in the POWERDIP, in which 9 pins (from 10 to 18) are attached to the frame and remove the heat produced by the chip. Figure 22 shows a PC Board copper area used as a Heatsink (l = 65mm). The Thermal Resis- tance Junction-Ambient is 35 °C. TDA7245 9/11 |
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