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TDA7263M 数据表(PDF) 5 Page - STMicroelectronics |
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TDA7263M 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() BUILT-IN PROTECTION SYSTEMS THERMAL SHUT-DOWN The presence of a thermal limiting circuit offers the following advantages: 1-an overload on the output (even if it is perma- nent), or an excessive ambient temperature can be easily withstood. 2-the heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no device damage in the case of excessive junction temperature; all that happens is that PO (and therefore Ptot) and IO are reduced. SHORT CIRCUIT (AC CONDITIONS) The TDA7263M can withstand accidental short circuits across the speaker made by a wrong con- nection during normal play operation. APPLICATION SUGGESTION The recommended values of the components are those shown on application circuit of figure 1. Different values can be used; the following table can help the designer. Component Recomm. Value Purpose Larger Than Smaller Than R1 and R3 1.5K Ω Close loop gain setting (*) Increase of gain Decrease of gain R2 and R4 47 Ω Close loop gain setting (*) Decrease of gain Increase of gain R5 and R6 4.7 Ω Frequency stability Danger of oscillations C1 and C2 100nF Input DC decoupling Higher SVR Higher low frequency cutoff C3 47 µF - Ripple Rejection - Mute time constant Increase of the Switch-on time - Degradation of SVR - Worse turn-off pop by muting C4 100nF Supply Voltage Bypass Danger of oscillations C5 1000 µF Supply Voltage Bypass C6 and C7 47 µF Feedback input DC decoupling Increase of the Switch-on time Decrease of the Switch-on time C8 and C9 0.1 µF Frequency stability Danger of oscillations C10 and C11 1000 µF Output DC decoupling Higher low-frequency cut-off (*) Closed loop gain must be higher than 26dB Figure 8: P. C. Board and Component Layout of the Application Circuit (1:1 scale). TDA7263M 5/7 |
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