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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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M38041F1HKP 数据表(PDF) 109 Page - Renesas Technology Corp |
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M38041F1HKP 数据表(HTML) 109 Page - Renesas Technology Corp |
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109 / 387 page  1-91 REJ09B0212-0100Z Rev.1.00 Jan 14, 2005 3804 Group (Spec.H) HARDWARE FUNCTIONAL DESCRIPTION q Parallel I/O Mode The parallel I/O mode is used to input/output software commands, address and data in parallel for operation (read, program and erase) to internal flash memory. Use the external device (writer) only for 3804 Group (spec. H). For details, refer to the user’s manual of each writer manufacturer. • User ROM and Boot ROM Areas In parallel I/O mode, the User ROM and Boot ROM areas shown in Figure 77 can be rewritten. Both areas of flash memory can be operated on in the same way. The Boot ROM area is 4 Kbytes in size and located at addresses F00016 through FFFF16. Make sure program and block erase op- erations are always performed within this address range. (Access to any location outside this address range is prohibited.) In the Boot ROM area, an erase block operation is applied to only one 4 Kbyte block. The boot ROM area has had a standard serial I/O mode control program stored in it when shipped from the fac-tory. Therefore, using the MCU in standard serial I/O mode, do not rewrite to the Boot ROM area. |
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