APPLICATION HINTS:

For 12V supply and 8

Ω speaker application, its

maximum power dissipation is about 1W.

Assumming that max ambient temperature is

70

°C. Required thermal resistance of the device

and heat dissipating means must be equal to (150

- 70)/1 = 80

°C/W.

Junction to pin thermal resistance of the package

is about 15

°C/W. That means external heat sink

of about 65

°C/W is required.

Cu ground plane of PCB can be used as heat dis-

sipating means.

current.

IN

SVR

P-GND

100

µF

470

µF

OUT

8

Ω

0.1

µF

47

µF

IN

D94AU166

STAND-BY

APPLICATION CIRCUIT

TDA7267

3/5