Document Number: 28300

For technical questions, contact: aluminumcaps1@vishay.com

www.vishay.com

Revision: 28-May-08

3

085 CS

Aluminum Capacitors

SMD (Chip) Standard

Vishay BCcomponents

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time. The temperature is that measured on the

soldering pad during processing.

For maximum conditions of different soldering methods see

Figs 5, 6 and 7.

Any temperature/time curve which does not exceed the

specified maximum curves may be applied.

AS A GENERAL PRINCIPLE,

TEMPERATURE AND

DURATION SHALL BE THE MINIMUM NECESSARY

REQUIRED

TO

ENSURE

GOOD

SOLDERING

CONNECTIONS.

Table 3

Table4

b

a

d

c

flow-direction of solder

For dimensions a, b, c and d, refer to Table 3

Flow direction of solder preferably onto side-walls or plus-side of the capacitors

Fig.4 Minimum ditances between 085 CS capacitors on a printed-circuit board for wave soldering

MINIMUM DISTANCES BETWEEN CAPACITORS in millimeters

NOMINAL CASE SIZE

L x W x H

CASE

CODE

8.8 x 3.7 x 3.9

1a

12

12

6.8

6.8

11.9 x 3.7 x 3.9

1

15

15

6.8

6.8

CURING CONDITIONS FOR SMD-GLUE

(

°C)

MAX. EXPOSURE TIME

(minutes)

125

10

140

3

150

1

160

0.5

280

260

240

220

200

180

160

140

120

100

80

0

50

100

150

200

250

T

Pad

(°C)

Fig.5 Maximum temperature load during infrared reflow soldering

f(s)

280

260

240

220

200

180

160

140

120

100

80

0

50

100

150

200

250

T

Pad

(°C)

Fig.6 Maximum temperature load during vapor phase reflow soldering

f(s)