In Figure 7 is shown the application diagram of the

TDA8143, the few external component and the

automatic handling possibility ensures a lower ap-

plication cost versus the conventional approach

shown in Figure 3.

In Figure 8 is shown the currents and voltage

waveforms of the driver circuit of Figure 7 as to be

at minimum.

The power dissipation on this application condition

is about 1.3W.

The presence of thermal shut-down circuit means

that the heatsink can have a smaller factor of safety

compared with that of a conventional circuit.

If for any reason, the junction temperature in-

creases up to 150

switches off the device.

&

C

VOLTAGE

CONTROL

V < 7V

j

OVERTEMP.

PROTECTION

T < 150˚C

&

Q9

V1

R2

R1

INPUT

TRANSCONDUCTANCE

AMPLIFIER

V2

Q10

Q11

R5

D2

Q7

Q6

R4

D1

Q1

Q4

Q3

R3

Q8

R6

Q2

Q5

I

1

I

2

REF

IN

V

V

= 750mV

OUTPUT

I

B

SENSE

INPUT

V

+

CC

PROTECTION

AND REMOTE

STANDBY INPUT

CONTROL

INPUT

SPECIAL

REMOTE

STANDBY

SENSE

GROUND

C

EXT

C

T

9

8

7

6

15

4

2

3

POWER

GROUND

Figure 6 : Block Diagram of the Integrated Horizontal Driver

TDA8143

7/9