Document Number: 61023

For technical questions, contact: efi@vishay.com

www.vishay.com

Revision: 12-Mar-08

55

BCR

Thin Film, Back-Contact Resistor

Vishay Electro-Films

DIMENSIONS in inches

Note:

• Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection.

SCHEMATIC

Options:

Gold bonding pads, 15 kÅ minimum thickness

Consult Applications Engineer

TYPICAL RANGE

1.6 k

Ω - 1 MΩ

0.016

0.020

0.020

TYPICAL RANGE

180

Ω - 2.2 kΩ

TYPICAL RANGE

24

Ω - 220 Ω

0.004

TYPICAL RANGE

10

Ω - 23 Ω

Bond Pad

Back of Chip

MECHANICAL SPECIFICATIONS in inches

PARAMETER

Chip Size

0.020 x 0.020 ± 0.002 (0.50 x 0.50 ± 0.05 mm)

Chip Thickness

0.010 ± 0.003 (0.253 ± 0.05 mm)

Chip Substrate Material

Resistor Material

Tantalum nitride, self-passivating

Bonding Pad Size

0.004 x 0.004 (0.100 x 0.100 mm)

Number of Pads

1

Pad Material

10 kÅ minimum aluminum

Backing

3 kÅ minimum gold

Recommended Attachment Method

Eutectic or conductive epoxy

ORDERING INFORMATION

Example: 100 % visual, 16 k

Ω, ± 1 %, ± 250 ppm/°C TCR, aluminum pads, class H visual inspection

W

INSPECTION/

PACKAGING

W = 100 % visually inspected

parts in matrix tray per

MIL-STD-883

X = Sample, visually inspected

parts loaded in matrix trays

(4 % AQL)

BCR

PRODUCT

FAMILY

008

PROCESS

CODE

See Process Code

table

1600

RESISTANCE

VALUE

Use first 4 digits

significant digits of the

resistance

1

MULTIPLIER

CODE

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

F

TOLERANCE

CODE

B = 0.1 %

C = 0.2 %

D = 0.5 %

F = 1.0 %

G = 2.0 %

H = 2.5 %

J = 5.0 %

K = 10 %