Document Number: 31506

For technical questions, contact: ff2aresistors@vishay.com

www.vishay.com

Revision: 25-Aug-06

33

SOGC 01, 03, 05

Thick Film Resistor Networks, Dual-In-Line

Small Outline Molded Dip, 01, 03, 05 Schematics

Vishay Dale

DIMENSIONS in inches [millimeters]

0.105

[2.67]

0.100 [2.54]

0.010 ± 0.005

[0.254 ± 0.127]

0.406 ± 0.012

[10.31 ± 0.305]

0.028 ± 0.010

[0.711 ± 0.254] Typ.

0.008

[0.203]

0.295

[7.49]

0.045 [1.14]

Ref.

Pin 1

0.045

[1.14]

A

0.050 [1.27]

Non-Accum. Typ.

0.018 [0.457] Typ.

B

SOGC

0.006 [0.152] Max. Typ.

GLOBAL MODEL

AB

SOGC16

0.440 [11.18]

0.350 [8.89]

SOGC20

0.540 [13.72]

0.450 [11.43]

TECHNICAL SPECIFICATIONS

PARAMETER

UNIT

S0GC16

S0GC20

Package Power Rating (max. at + 70°C)

W

1.6

2.0

TC Tracking (- 55°C to + 125°C)

ppm/°C

± 50

Voltage Coefficient of Resistance:

ppm/V

< 50 typical

Maximum Operating Voltage:

VDC

50

Operating Temperature Range:

°C

- 55 to + 125

Storage Temperature Range:

°C

- 55 to + 150

MECHANICAL SPECIFICATIONS

Marking:

Model number, schematic number, value tolerance, pin 1 indicator, date code

Marking Resistance to Solvents:

Permanency testing per MIL-STD-202, Method 215

Maximum Solder Reflow Temperature:

+ 255 °C

Solderability:

Per MIL-STD-202, Method 208E

Terminals:

Copper alloy. Solder dipped terminal

Body:

Molded epoxy