Document Number: 61037

For technical questions, contact: efi@vishay.com

www.vishay.com

Revision: 14-Mar-08

93

MIC

Thin Film Microwave Resistor

Vishay Electro-Films

DIMENSIONS in inches

SCHEMATIC

Options:

Terminations: Aluminum, nickel solder (62/32/2)

Gold back for solder die attach

Contact Applications Engineer

0.020

0.040

0.012

0.010

TYPICAL RANGE

20

Ω - 20 kΩ

0.020

0.040

0.012

0.010

TYPICAL RANGE

6.2

Ω - 19 Ω

0.020

0.040

0.012

0.010

TYPICAL RANGE

2

Ω - 6 Ω

MECHANICAL SPECIFICATIONS in inches

PARAMETER

Chip Size

0.020 x 0.040 ± 0.003

(0.5 x 1.0 ± 0.076 mm)

Chip Thickness

0.010 ± 0.002 (0.254 ± 0.05 mm)

Chip Substrate

Material

99.6 % alumina, 2 - 4 microinch finish

Resistor Material

Tantalum nitride, self passivating

Bonding Pad Size

0.010 x 0.012 (0.254 x 0.30 mm)

minimum

Number of Pads

2

Pad Material

25 kÅ minimum gold standard

Backing

None

ORDERING INFORMATION

Example: 100 % visualled, 50

Ω, ± 10 %, ± 100 ppm/°C TCR, gold pads, class H visual inspection

W

INSPECTION/

PACKAGING

W = 100 % visually inspected

parts in matrix trays per

MIL-STD-883

X = Sample, visually inspected

parts loaded in matrix

trays (4 % AQL)

MIC

PRODUCT

FAMILY

001

PROCESS

CODE

5000

RESISTANCE

VALUE

Use first 4 digits

significant digits of the

resistance

B

MULTIPLIER

CODE

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

K

TOLERANCE

CODE

F = 1.0 %

G = 2.0 %

H = 2.5 %

J = 5.0 %

K = 10 %

50.40

50.30

50.20

50.10

50.00

49.90

49.80

49.70

49.60

0.00 E + 00 5.00 E + 08 1.00 E + 09 1.50 E + 0.9 2.00 E + 09 2.50 E + 09 3.00 E + 09 3.50 E + 09

FREQUENCY (Hz)

IMPEDANCE VS FREQUENCY

50

Ω, 20 x 40 MIL SIZE