TS4972

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Fig. 87 :TS4972 Footprint Recommendation (Non Solder Mask Defined)

TOP VIEW OF THE DAISY CHAIN MECHANICAL DATA ( all drawings dimensions are in millimeters )

REMARKS

Daisy chain sample is featuring pins connection two by two. The schematic above is illustrating the way

connecting pins each other. This sample is used for testing continuity on board. PCB needs to be designed

on the opposite way, where pin connections are not done on daisy chain samples. By that way, just

connecting an Ohmeter between pin 8 and pin 1, the soldering process continuity can be tested.

ORDER CODE

Pad in Cu 35µm with Flash NiAu (6µm, 0.15µm)

150µm min.

500µm

500µm

Φ=250µm

Φ=400µm

75µm min.

100µm max.

Track

Solder mask opening

Pad in Cu 35µm with Flash NiAu (6µm, 0.15µm)

150µm min.

500µm

500µm

Φ=250µm

Φ=400µm

75µm min.

100µm max.

Track

Solder mask opening

Pad in Cu 35µm with Flash NiAu (6µm, 0.15µm)

150µm min.

500µm

500µm

Φ=250µm

Φ=400µm

75µm min.

100µm max.

Track

Solder mask opening

Pad in Cu 35µm with Flash NiAu (6µm, 0.15µm)

150µm min.

500µm

500µm

Φ=250µm

Φ=400µm

75µm min.

100µm max.

Track

Solder mask opening

Pad in Cu 35µm with Flash NiAu (6µm, 0.15µm)

150µm min.

500µm

500µm

Φ=250µm

Φ=400µm

75µm min.

100µm max.

Track

Solder mask opening

12

4

5

6

7

3

8

Vin

Gnd

Bypass

Vout2

Stdby

Vcc

Vin+

Vout1

2.26 mm

1.6 mm

12

4

5

6

7

3

8

Vin

Gnd

Bypass

Vout2

Stdby

Vcc

Vin+

Vout1

2.26 mm

1.6 mm

Part Number

Temperature

Range

Package

Marking

J

TSDC03IJT

-40, +85

°C

•

DC3