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数据搜索系统，热门电子元器件搜索 |
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TS4990 数据表(PDF) 5 Page - STMicroelectronics |
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TS4990 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 6 page  TS4990 5/6 TS4990IJT PIN OUT (top view) MARKING (top view) PACKAGE MECHANICAL DATA FLIP CHIP - 9 BUMPS s Balls are underneath STBY Vin+ Vout1 Vin- GND GND VCC BYPASS VOUT2 1 2 3 4 5 6 7 8 9 STBY Vin+ Vout1 Vin- GND GND VCC BYPASS VOUT2 1 2 3 4 5 6 7 8 9 s ST Logo s Part number 4990 s Three digits Datecode : YWW s The dot is for marking pin 1 YWW 4990 250µm YWW 4990 250µm s Die size : (1.6mm ±10%) x (1.6mm ±10%) s Die height (including bumps) : 600µm ±30µm s Bumps diameter : 315µm ±15µm s Pitch: 500µm ±10µm 1.6mm 0.5mm 0.5mm 1.6mm 1.6mm 0.5mm 0.5mm 1.6mm 600µm 600µm |
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