DS564F2

21

CS5341

Confidential Draft

3/11/08

6. PACKAGE DIMENSIONS

1.

“D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold

mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per

side.

2.

Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be

0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-

duce dimension “b” by more than 0.07 mm at least material condition.

3.

These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.

THERMAL CHARACTERISTICS

INCHES

MILLIMETERS

NOTE

DIM

MIN

NOM

MAX

MIN

NOM

MAX

A

--

--

0.043

--

--

1.10

A1

0.002

0.004

0.006

0.05

--

0.15

A2

0.03346

0.0354

0.037

0.85

0.90

0.95

b

0.00748

0.0096

0.012

0.19

0.245

0.30

2,3

D

0.193

0.1969

0.201

4.90

5.00

5.10

1

E

0.248

0.2519

0.256

6.30

6.40

6.50

E1

0.169

0.1732

0.177

4.30

4.40

4.50

1

e

--

0.026 BSC

--

--

0.65 BSC

--

L

0.020

0.024

0.028

0.50

0.60

0.70

µ

0°

4°

8°

0°

4°

8°

JEDEC #: MO-153

Controlling Dimension is Millimeters

Parameter

Symbol

Min

Typ

Max

Unit

Allowable Junction Temperature

-

-

135

°C

Junction to Ambient Thermal Impedance

θ

JA

-75-

°C/W

16L TSSOP (4.4 mm BODY) PACKAGE DRAWING

E

N

1 23

e

A1

A2

A

D

SEATING

PLANE

L

SIDE VIEW

END VIEW

TOP VIEW

∝