PACKAGE THERMAL RESISTANCE FOR TSSOP (PW) PACKAGE

(1)

ABSOLUTE MAXIMUM RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

RECOMMENDED CRYSTAL SPECIFICATIONS

(1)

CDCS502

THERMAL AIR FLOW (CFM)

CDCV304PW 8-PIN TSSOP

UNIT

0

150

250

500

High K

149

142

138

132

°C/W

Low K

230

185

170

150

°C/W

High K

65

°C/W

High K

69

°C/W

(1)

The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

Supply voltage range

–0.5 to 4.6

V

Input voltage range

–0.5 to 4.6

V

Output voltage range

–0.5 to 4.6

V

±20

mA

Continuous output current

±50

mA

Storage temperature range

–65 to 150

°C

Maximum junction temperature

125

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

MIN

NOM

MAX

UNIT

Supply voltage

3.0

3.6

V

Input Frequency

8

32

MHz

Low level input voltage LVCMOS

0.3 VDD

V

High level input voltage LVCMOS

0.7 VDD

V

Input Voltage threshold LVCMOS

0.5 VDD

V

Output Test Load LVCMOS

10

pF

Output Current

12

mA

Operating free-air temperature

–40

85

°C

PARAMETER

CONDITIONS

MIN

NOM

MAX

UNIT

FS = 0

8

32

Crystal input frequency range

MHz

FS = 1

8

27

ESR

180

Ω

On-chip load capacitance at Xin and Xout

10

pF

Crystal power dissipation

50

µW

(1)

For further details on the crystal, see the crystal part in the Applications section

(2)

With 5 pF crystal package parallel capacitance

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